Qualcomm MDM9230 Chipset 4G Embedded Wireless Modules MC7455 USB 3.0

Qualcomm MDM9230 Chipset 4G Embedded Wireless Modules MC7455 USB 3.0

LTE-FDD,LTE-TDD HSPA+,TD-SCDMA

(B1-B5,,B7,B8,B12,B13,B17,B20,B25,B26,B29,B30,B41)

Main Specifications

Cellular

• FDD/TDD LTE (Cat 6)

1-5,7,8,12,13,17,20,25,26,29,30,41

• Carrier Aggregation

4+17, 2+17, 2+29, 4+5, 17+30, 2+13, 4+13, 4+4,

41+41, 3+20, 7+20, 3+3, 7+7

• DC-HSPA+ (42/5.76 Mbps)

1,2,3,4,5,8

Key Features

• Qualcomm MDM9230 chipset

• Single SKU for North America and Europe

• GNSS

• Dedicated GPS connector with GPS bias or

shared on diversity (TBD)

• GPS, Glonass, Galileo ,BeiDou

• SUPL 1.0, 2.0, XTRA2.0

• Optional support for VoLTE and CSFB voice through

future FW update

• Low power consumption

• Envelope tracking

• Software

• Gobi API, Image switching, MBIM interface

• Basic and Extended AT Commands

• Skylight for Windows 7, 8/8.1

• Linux and Android

Information

Physical Characteristics
1	• Mini card 51 X 30 X 2.75 [mm]
2	• USB 3.0
3	• GPIOs for antenna tuning and SAR control
4	• PCM/I2S interface for voice (Future FW update)
Temperature ranges:
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